XZZ 2015 Solder Wick 2.0mm x 1.5m

In stock

3.99 £

Brand:

XZZ

2.0mm x 1.5m High-Efficiency Desoldering Wick

Rapid Capillary Absorption: Quickly wicks away molten solder cleanly and efficiently from printed circuit boards.
Low-Residue Flux: Clean copper braid leaves minimal flux residue behind, reducing cleanup time.
Pure Copper Weave: Soft, anti-oxidation copper mesh ensures fast heat conduction and minimal thermal stress.

Details

Please Note: Pictures are for illustration purposes only.

XZZ 2015 Solder Wick 2.0mm x 1.5m

Achieve clean, professional desoldering results with the XZZ 2015 Solder Wick. Engineered specifically for micro-soldering technicians and smartphone repair specialists, this high-performance copper desoldering braid provides exceptional thermal transfer and rapid solder absorption during component removal and pad cleaning.

The XZZ desoldering wick features a pure copper soft weave design treated with a low-residue flux that promotes instant capillary action. Its 2.0mm width and 1.5m length format is ideal for delicate SMD pads, IC pins, and fine-pitch component desoldering, minimizing the risk of thermal damage to circuit boards.

Key Performance Features:

Rapid Capillary Action: High-purity copper braid draws solder instantly away from delicate circuit board pads.
Low-Residue Composition: Minimizes leftover flux to protect board cleanliness and reduce post-repair cleanup.
Thermal Efficiency: Soft woven design optimizes heat transfer from the soldering iron tip for safe component removal.
Anti-Oxidation Coating: Resists corrosion and maintains peak absorption performance over time.
Wide Application Range: Ideal for smartphone logic board repair, PCB rework, and micro-electronics maintenance.

Data

Weight:

40 g/pcs