ReLife RL-406 217°C Solder Paste 40g Syringe
10.49 £
ReLife RL-406 217°C Solder Paste 40g Syringe
In stock
10.49 £
Brand:
ReLife
217°C High-Temperature Lead-Free Solder Paste (40g Syringe)
- 217°C High Melting Point: Engineered for high-reliability lead-free BGA reballing and logic board component attachment.
- Precision Syringe Dispensing: Syringe barrel enables direct, micro-dose application on fine-pitch SMD pads.
- 40g Workshop Capacity: Generous volume for continuous daily use in professional phone repair labs.
Details
Please Note: Pictures are for illustration purposes only. Plunger and dispensing needles sold separately. Refrigeration recommended.
ReLife RL-406 217°C Lead-Free Solder Paste 40g Syringe
Achieve professional, high-reliability solder joints with the ReLife RL-406 217°C Lead-Free Solder Paste Syringe. Formulated specifically for micro-soldering technicians and smartphone logic board specialists, this high-temperature solder paste provides superior thermal stability and mechanical joint strength for demanding electronic repairs.
With its 217°C melting point, the RL-406 paste is engineered for lead-free SAC-alloy reballing and SMD component placement on Apple, Android, and laptop motherboards. The convenient syringe packaging allows pinpoint dispensing directly onto circuit traces and micro BGA pads, preventing waste and ensuring clean reflow operations.
Key Performance Features:
- 217°C Reflow Profile: Ideal for structural middle-frame soldering, CPU reballing, and high-heat tolerance ICs.
- Pinpoint Dispensing: Syringe barrel format minimizes material exposure to air and enables precise pad dosing.
- High Oxidation Resistance: Retains active wetting characteristics under continuous hot-air gun application.
- Strong Electrical & Mechanical Joints: Produces clean, bright solder joints with minimal voiding and high shear strength.
- Professional 40g Size: Cost-effective capacity designed for heavy daily bench use in micro-repair environments.
Data
Weight:
60 g/pcs
