ReLife RL-405 138°C 3ml Nano Solder Paste Syringe
3ml 138°C Low-Temperature Nano Solder Paste Syringe
- 138°C Low-Temperature Profile: Prevents heat damage to sensitive flexible printed circuits (FPCs) and plastic connectors.
- Nano-Particle Formulation: Ultra-fine alloy particles ensure rapid melting and flawless wetting on micro-pads.
- Precision Syringe Delivery: Compact 3ml syringe enables controlled micro-dosing directly onto flat ribbon cables.
Please Note: Pictures are for illustration purposes only.
ReLife RL-405 138°C 3ml Nano Solder Paste Syringe
Achieve clean, high-reliability solder joints on delicate flexible printed circuits with the ReLife RL-405 138°C 3ml Nano Solder Paste. Engineered specifically for smartphone repair technicians and micro-soldering specialists, this advanced low-temperature paste provides exceptional thermal transfer and oxidation resistance during intricate FPC and ribbon cable repairs.
The nano solder paste features an ultra-fine particle composition that promotes smooth solder wetting across fine-pitch SMD components, logic board traces, and display connectors at a safe 138°C melting threshold. Its convenient 3ml syringe packaging ensures controlled micro-dosing directly onto target areas, eliminating waste and reducing cleanup time.
Key Performance Features:
- 138°C Thermal Profile: Safely solders heat-sensitive FPC connectors without causing thermal warping or melting.
- Nano-Particle Uniformity: Ultra-fine alloy distribution ensures rapid melting and flawless wetting on micro-pads.
- Low Residue Formula: Leaves minimal, non-corrosive residue preventing electrical leakage on sensitive traces.
- Precision Syringe Delivery: Allows accurate, controlled application on tiny FPC pins and jumper wires.
- Wide Application Range: Ideal for iPhone and Android FPC cable repair, touch screen connectors, and micro-electronics.