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ReLife RL-2015 Solder Wick 2.0mm x 1.5m
ReLife RL-2015 Solder Wick 2.0mm x 1.5m
3.49 £
  1. De-Soldering Wick
  1. Consumables
  2. De-Soldering Wick

ReLife RL-2015 Solder Wick 2.0mm x 1.5m

ReLife RL-2015 Solder Wick 2.0mm x 1.5m
ReLife RL-2015 Solder Wick 2.0mm x 1.5m
ReLife RL-2015 Solder Wick 2.0mm x 1.5m
ReLife RL-2015 Solder Wick 2.0mm x 1.5m
ReLife RL-2015 Solder Wick 2.0mm x 1.5m
ReLife RL-2015 Solder Wick 2.0mm x 1.5m
ReLife RL-2015 Solder Wick 2.0mm x 1.5m
ReLife RL-2015 Solder Wick 2.0mm x 1.5m
ReLife RL-2015 Solder Wick 2.0mm x 1.5m
ReLife RL-2015 Solder Wick 2.0mm x 1.5m
ReLife RL-2015 Solder Wick 2.0mm x 1.5m
ReLife RL-2015 Solder Wick 2.0mm x 1.5m
ReLife RL-2015 Solder Wick 2.0mm x 1.5m
ReLife RL-2015 Solder Wick 2.0mm x 1.5m
In stock
3.49 £
Brand:
ReLife

2.0mm x 1.5m Desoldering Wick

  • Rapid Capillary Absorption: Quickly wicks away molten solder cleanly and efficiently from printed circuit boards.
  • Low-Residue Flux: Clean copper braid leaves minimal flux residue behind, reducing cleanup time.
  • Precision Width: 2.0mm format ideal for standard SMD pads and fine-pitch component desoldering.
Details

Please Note: Pictures are for illustration purposes only.

ReLife RL-2015 Solder Wick 2.0mm x 1.5m

Achieve clean, professional desoldering results with the ReLife RL-2015 Solder Wick. Engineered specifically for micro-soldering technicians and smartphone repair specialists, this high-performance copper desoldering braid provides exceptional thermal transfer and rapid solder absorption during component removal and pad cleaning.

The RL-2015 wick features a pure copper soft weave design treated with a low-residue flux that promotes instant capillary action. Its 2.0mm width and 1.5m length format is ideal for standard SMD pads, IC pins, and fine-pitch component desoldering, minimizing the risk of thermal damage to circuit boards.

Key Performance Features:

  • Rapid Capillary Action: High-purity copper braid draws solder instantly away from delicate circuit board pads.
  • Low-Residue Composition: Minimizes leftover flux to protect board cleanliness and reduce post-repair cleanup.
  • Thermal Efficiency: Optimizes heat transfer from the soldering iron tip for quick, safe component removal.
  • Anti-Oxidation Coating: Resists corrosion and maintains peak absorption performance over time.
  • Wide Application Range: Ideal for smartphone logic board repair, PCB rework, and micro-electronics maintenance.
Data
Weight:
35 g/pcs
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