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Mechanic iSM5 183°C 3ml Jump Wire Solder Paste
Mechanic iSM5 183°C 3ml Jump Wire Solder Paste
7.49 £
  1. 138°C / 183°C Nano Solder Paste for FPC's
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  2. Soldering Paste
  3. 138°C / 183°C Nano Solder Paste for FPC's

Mechanic iSM5 183°C 3ml Jump Wire Solder Paste

Mechanic iSM5 183°C 3ml Jump Wire Solder Paste
Mechanic iSM5 183°C 3ml Jump Wire Solder Paste
Mechanic iSM5 183°C 3ml Jump Wire Solder Paste
Mechanic iSM5 183°C 3ml Jump Wire Solder Paste
Mechanic iSM5 183°C 3ml Jump Wire Solder Paste
Mechanic iSM5 183°C 3ml Jump Wire Solder Paste
Mechanic iSM5 183°C 3ml Jump Wire Solder Paste
Mechanic iSM5 183°C 3ml Jump Wire Solder Paste
Mechanic iSM5 183°C 3ml Jump Wire Solder Paste
Mechanic iSM5 183°C 3ml Jump Wire Solder Paste
Mechanic iSM5 183°C 3ml Jump Wire Solder Paste
Mechanic iSM5 183°C 3ml Jump Wire Solder Paste
Mechanic iSM5 183°C 3ml Jump Wire Solder Paste
Mechanic iSM5 183°C 3ml Jump Wire Solder Paste
Mechanic iSM5 183°C 3ml Jump Wire Solder Paste
Mechanic iSM5 183°C 3ml Jump Wire Solder Paste
In stock
7.49 £
Brand:
Mechanic

3ml Jump Wire Solder Paste Syringe with 3 Needles

  • Nano-Compound Formula: High-activity nano structure ensures effortless tinning and flawless flow on micro jumper wires.
  • 183°C Thermal Profile: Standard melting point optimized for precision logic board and flying line repairs.
  • Precision Syringe Kit: Includes 3 precision needles for controlled micro-dosing on fine-pitch pads.
Details

Please Note: Pictures are for illustration purposes only. Includes 3 precision dispensing needles.

Mechanic iSM5 183°C 3ml Jump Wire Solder Paste

Achieve clean, high-reliability solder joints for micro-jumpers and complex circuit traces with the Mechanic iSM5 183°C 3ml Jump Wire Solder Paste. Engineered specifically for micro-soldering technicians and smartphone repair specialists, this advanced liquid solder paste provides exceptional thermal transfer and rapid activation during intricate logic board repairs.

The iSM5 features a specialized Japanese-formulated nano-compound composition that promotes instant tinning and smooth solder flow across fine-pitch pads, IC pins, and jumper wires. Its convenient 3ml syringe packaging and included needle set ensure controlled micro-dosing directly onto target areas, eliminating bridging and messy residue.

Key Performance Features:

  • Nano-Compound Activity: High-activity formula enables instant wetting and tinning with a single touch of the iron.
  • 183°C Optimal Profile: Provides reliable structural integrity and strong electrical conductivity for standard repairs.
  • Bubble-Free Joints: Smooth, uniform paste texture prevents air voids, gaps, and spattering during reflow.
  • Precision Needle Kit: Supplied with 3 specialized dispensing tips for accurate placement on microscopic traces.
  • Wide Application Range: Ideal for iPhone fingerprint flex repairs, jump wire routing, and smartphone motherboard maintenance.
Data
Weight:
50 g/pcs
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