Mechanic XP4 148°C 35g Low-Temperature Solder Paste
5.49 £
Mechanic XP4 148°C 35g Low-Temperature Solder Paste
In stock
5.49 £
Brand:
Mechanic
148°C Low-Temperature PCB Solder Paste Jar
- Low Melting Point: 148°C temperature profile prevents heat damage to sensitive smartphone components and stacked logic boards.
- Smooth Reflow Performance: High-purity alloy ensures clean wetting and reliable electrical conductivity.
- Convenient 35g Jar: Generous quantity packaging ideal for workbench repairs and workshop use.
Details
Please Note: Pictures are for illustration purposes only.
Mechanic XP4 148°C 35g Low-Temperature Solder Paste
Achieve clean, high-reliability low-temperature solder joints with the Mechanic XP4 148°C 35g Soldering Paste. Engineered specifically for micro-soldering technicians and smartphone repair specialists, this specialized low-melting-point solder paste provides excellent thermal transfer and oxidation resistance during delicate board-level repairs, preventing heat damage to adjacent components.
The XP4 solder paste features a refined alloy composition that promotes smooth solder wetting across fine-pitch BGA pads, IC chips, and SMD components. Its convenient 35g jar packaging ensures an ample supply for repair workshops, enabling easy application for CPU reballing and stacked board repairs.
Key Performance Features:
- 148°C Low-Temperature Profile: Safely solders stacked logic boards without risking thermal warp or heat damage to chips.
- Superior Wetting Performance: Accelerates solder flow and prevents bridging on high-density logic boards.
- High-Conductivity Alloy: Ensures stable, low-resistance electrical connections for critical circuitry.
- Workshop Packaging: Convenient 35g jar provides excellent value and continuous workbench availability.
- Wide Application Range: Ideal for iPhone CPU reballing, Android logic board repair, and sensitive electronics maintenance.
Data
Weight:
60 g/pcs
