MaAnt MY-17A 217°C Lead-Free Solder Paste 50g
10.49 £
MaAnt MY-17A 217°C Lead-Free Solder Paste 50g
In stock
10.49 £
Brand:
MaAnt
217°C High-Temperature Lead-Free Solder Flux Paste (50g Tub)
- 217°C High Melting Point: Engineered for high-reliability, lead-free BGA reballing and logic board component attachment.
- Superior BGA Reballing: Delivers precise solder ball formation without bridging or voiding on fine-pitch IC chips.
- 50g Workshop Jar: High-capacity tub ideal for professional phone repair technicians and micro-soldering labs.
Details
Please Note: Pictures are for illustration purposes only. Refrigeration recommended for extended shelf life.
MaAnt MY-17A 217°C Lead-Free Solder Paste 50g
Achieve professional, high-reliability solder joints with the MaAnt MY-17A 217°C Lead-Free Solder Paste. Formulated specifically for micro-soldering technicians and smartphone logic board specialists, this high-temperature solder paste provides superior thermal stability and mechanical joint strength for demanding electronic repairs.
With its 217°C melting point, the MY-17A paste is engineered for lead-free SAC-alloy reballing and SMD component placement on Apple, Android, and laptop motherboards. It ensures excellent stencil release, minimal tin-beading, and strong anti-oxidation during hot-air reflow operations.
Key Performance Features:
- 217°C Reflow Profile: Perfect for structural middle-frame soldering, CPU reballing, and high-heat tolerance ICs.
- Fine-Pitch Stencil Printing: Uniform particle size ensures smooth, repeatable printing without bridging or micro-solder balls.
- High Oxidation Resistance: Retains active wetting characteristics under continuous hot-air gun application.
- Strong Electrical & Mechanical Joints: Produces clean, bright solder joints with minimal voiding and high shear strength.
- Professional 50g Jar: Cost-effective size packaged in a sealed container to prevent drying and oxidation.
Data
Weight:
80 g/pcs
