Chemtronics Soder-Wick Size #4 Desoldering Braid 2.8mm x 1.5m
4.99 £
Chemtronics Soder-Wick Size #4 Desoldering Braid 2.8mm x 1.5m
In stock
4.99 £
Brand:
Chemtronics
2.8mm x 1.5m Size #4 Soder-Wick Desoldering Braid
- Rapid Capillary Action: High-purity copper braid draws solder instantly away from larger circuit board pads.
- ESD-Safe Packaging: Static-dissipative bobbin prevents electrostatic discharge damage to sensitive electronic components.
- Low-Residue Flux: Clean chemical formulation leaves minimal flux residue behind, reducing post-repair cleanup time.
Details
Please Note: Pictures are for illustration purposes only.
Chemtronics Soder-Wick Size #4 Desoldering Braid 2.8mm x 1.5m
Achieve clean, professional desoldering results with the Chemtronics Soder-Wick Size #4. Engineered specifically for micro-soldering technicians and smartphone repair specialists, this high-performance copper desoldering braid provides exceptional thermal transfer and rapid solder absorption during component removal and pad cleaning.
The Soder-Wick features an ultra-fine, clean-braid copper design treated with a low-residue, high-activity flux that promotes instant capillary action. Its 2.8mm width and 1.5m length format is ideal for larger SMD pads, multi-pin ICs, and through-hole component desoldering, minimizing the risk of thermal damage to circuit boards.
Key Performance Features:
- Rapid Capillary Action: High-purity copper braid draws solder instantly away from larger circuit board pads.
- ESD-Safe Protection: Supplied on a static-dissipative bobbin to safeguard sensitive logic boards and microchips.
- Low-Residue Flux System: Minimizes leftover flux to protect board cleanliness and reduce post-repair cleanup.
- Thermal Efficiency: Optimizes heat transfer from the soldering iron tip for quick, safe component removal.
- Wide Application Range: Ideal for smartphone logic board repair, PCB rework, and micro-electronics maintenance.
Data
Weight:
40 g/pcs
