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  1. 138°C / 183°C Nano Solder Paste for FPC's
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  3. 138°C / 183°C Nano Solder Paste for FPC's

2UUL Nano 183°C 3ml Solder Paste

2UUL Nano 183°C 3ml Solder Paste
2UUL Nano 183°C 3ml Solder Paste
2UUL Nano 183°C 3ml Solder Paste
2UUL Nano 183°C 3ml Solder Paste
2UUL Nano 183°C 3ml Solder Paste
2UUL Nano 183°C 3ml Solder Paste
2UUL Nano 183°C 3ml Solder Paste
2UUL Nano 183°C 3ml Solder Paste
2UUL Nano 183°C 3ml Solder Paste
2UUL Nano 183°C 3ml Solder Paste
2UUL Nano 183°C 3ml Solder Paste
2UUL Nano 183°C 3ml Solder Paste
2UUL Nano 183°C 3ml Solder Paste
2UUL Nano 183°C 3ml Solder Paste
2UUL Nano 183°C 3ml Solder Paste
2UUL Nano 183°C 3ml Solder Paste
2UUL Nano 183°C 3ml Solder Paste
2UUL Nano 183°C 3ml Solder Paste
Out of stock
7.49 £
Brand:
2UUL
Out of stock

3ml Nano Solder Paste Syringe for FPCs

  • Nano-Particle Formulation: Engineered with ultra-fine nano particles for precise wetting on flexible printed circuits (FPCs).
  • 183°C Melting Point: Optimal thermal profile for standard micro-soldering and delicate component attachment.
  • Precision Syringe Delivery: Compact 3ml syringe enables controlled micro-dosing directly onto flat ribbon cables and fine-pitch pads.
Details

Please Note: Pictures are for illustration purposes only.

2UUL Nano 183°C 3ml Solder Paste

Achieve clean, high-reliability solder joints on delicate flexible printed circuits with the 2UUL Nano 183°C 3ml Solder Paste. Engineered specifically for smartphone repair technicians and micro-soldering specialists, this advanced nano-formulated paste provides exceptional thermal transfer and oxidation resistance during intricate FPC and ribbon cable repairs.

The nano solder paste features an ultra-fine particle composition that promotes smooth solder wetting across fine-pitch SMD components, logic board traces, and display connectors. Its convenient 3ml syringe packaging ensures controlled micro-dosing directly onto target areas, eliminating waste and reducing cleanup time.

Key Performance Features:

  • Nano-Particle Uniformity: Ultra-fine alloy distribution ensures rapid melting and flawless wetting on micro-pads.
  • 183°C Thermal Profile: Ideal for standard component soldering and delicate connector replacements.
  • Low Residue Formula: Leaves minimal, non-corrosive residue preventing electrical leakage on sensitive traces.
  • Precision Syringe Delivery: Allows accurate, controlled application on tiny FPC pins and jumper wires.
  • Wide Application Range: Ideal for iPhone and Android FPC cable repair, touch screen connectors, and micro-electronics.
Data
Weight:
50 g/pcs
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