2UUL Mobi Desoldering Wick 5-Pack 2.0mm x 1.5m
Out of stock
13.99 £
Brand:
2UUL
Out of stock
5-Pack 2.0mm x 1.5m Mobi Desoldering Wick
- High-Speed Absorption: Rapidly draws up molten solder cleanly and efficiently from printed circuit boards.
- Low-Residue Flux: Clean copper braid leaves minimal flux residue behind, reducing cleanup time.
- Value 5-Pack Bundle: Multi-roll packaging ideal for busy repair workshops and continuous workbench use.
Details
Please Note: Pictures are for illustration purposes only.
2UUL Mobi Desoldering Wick 5-Pack 2.0mm x 1.5m
Achieve clean, professional desoldering results with the 2UUL Mobi Desoldering Wick 5-Pack. Engineered specifically for micro-soldering technicians and smartphone repair specialists, this high-performance copper desoldering braid provides exceptional thermal transfer and rapid solder absorption during component removal and pad cleaning.
The Mobi wick features an ultra-fine, clean-braid copper design treated with a low-residue flux that promotes instant capillary action. Its 2.0mm width and 1.5m length format per roll is ideal for standard SMD pads, IC pins, and through-hole component desoldering. Supplied in a convenient 5-pack value bundle, it ensures a continuous workbench supply for high-volume repair workshops.
Key Performance Features:
- Rapid Capillary Action: High-purity copper braid draws solder instantly away from delicate circuit board pads.
- Low-Residue Composition: Minimizes leftover flux to protect board cleanliness and reduce post-repair cleanup.
- Thermal Efficiency: Optimizes heat transfer from the soldering iron tip for quick, safe component removal.
- Value 5-Pack Bundle: Cost-effective multi-spool packaging ideal for busy repair technicians and workshops.
- Wide Application Range: Ideal for smartphone logic board repair, PCB rework, through-hole desoldering, and general electronics maintenance.
Data
Weight:
125 g/pcs
