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2UUL DW21 Solder Away Desoldering Wick 2.0mm x 2m
2UUL DW21 Solder Away Desoldering Wick 2.0mm x 2m
4.99 £
  1. De-Soldering Wick
  1. Consumables
  2. De-Soldering Wick
NEW

2UUL DW21 Solder Away Desoldering Wick 2.0mm x 2m

NEW
2UUL DW21 Solder Away Desoldering Wick 2.0mm x 2m
2UUL DW21 Solder Away Desoldering Wick 2.0mm x 2m
2UUL DW21 Solder Away Desoldering Wick 2.0mm x 2m
2UUL DW21 Solder Away Desoldering Wick 2.0mm x 2m
2UUL DW21 Solder Away Desoldering Wick 2.0mm x 2m
2UUL DW21 Solder Away Desoldering Wick 2.0mm x 2m
2UUL DW21 Solder Away Desoldering Wick 2.0mm x 2m
2UUL DW21 Solder Away Desoldering Wick 2.0mm x 2m
2UUL DW21 Solder Away Desoldering Wick 2.0mm x 2m
2UUL DW21 Solder Away Desoldering Wick 2.0mm x 2m
2UUL DW21 Solder Away Desoldering Wick 2.0mm x 2m
2UUL DW21 Solder Away Desoldering Wick 2.0mm x 2m
In stock
4.99 £
Brand:
2UUL

2.0mm x 2m Single Spool Solder Away Desoldering Wick

  • High-Speed Absorption: Rapidly draws up molten solder cleanly and efficiently from printed circuit boards.
  • Low-Residue Flux: Clean copper braid leaves minimal flux residue behind, reducing cleanup time.
  • Precision Spool: Single-spool packaging ideal for everyday workbench repairs and micro-soldering tasks.
Details

Please Note: Pictures are for illustration purposes only.

2UUL DW21 Solder Away Desoldering Wick 2.0mm x 2m

Achieve clean, professional desoldering results with the 2UUL DW21 Solder Away Desoldering Wick. Engineered specifically for micro-soldering technicians and smartphone repair specialists, this high-performance copper desoldering braid provides exceptional thermal transfer and rapid solder absorption during component removal and pad cleaning.

The DW21 wick features an ultra-fine, clean-braid copper design treated with a low-residue flux that promotes instant capillary action. Its 2.0mm width and 2m length format is ideal for standard SMD pads, IC pins, and through-hole component desoldering. Supplied as a convenient single spool, it ensures a reliable workbench supply for everyday repair tasks.

Key Performance Features:

  • Rapid Capillary Action: High-purity copper braid draws solder instantly away from delicate circuit board pads.
  • Low-Residue Composition: Minimizes leftover flux to protect board cleanliness and reduce post-repair cleanup.
  • Thermal Efficiency: Optimizes heat transfer from the soldering iron tip for quick, safe component removal.
  • Standard Spool Packaging: Convenient single-roll packaging ideal for individual technicians and hobbyists.
  • Wide Application Range: Ideal for smartphone logic board repair, PCB rework, through-hole desoldering, and general electronics maintenance.
Data
Weight:
60 g/pcs
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