PPD S260 138°C 50g Low-Temperature Solder Paste
10.99 £
PPD S260 138°C 50g Low-Temperature Solder Paste
In stock
10.99 £
Brand:
PPD
- Low-Temperature 138°C: Sn42/Bi58 alloy prevents thermal damage during sensitive PCB and mobile motherboard repairs.
- Smooth Consistency: Formulated for precision BGA reballing, fine-pitch stencil printing, and reliable wetting.
- 50g Capacity: Generous jar size designed for professional electronics repair workshops.
Details
Please Note: The pictures are for illustration purposes only.
PPD S260 138°C 50g Low-Temperature Solder Paste
Discover precision and reliability with the PPD S260 138°C 50g Low-Temperature Solder Paste, engineered for professional electronics soldering tasks. Formulated with a low melting point of 138°C, this high-performance paste prevents thermal damage to sensitive components during smartphone motherboard repairs, PCB assembly, and delicate BGA reballing.
Key Features
- Optimal Low Melting Point: Operates safely at 138°C, drastically reducing the risk of thermal stress or IC failure.
- Professional Grade Viscosity: Ensures optimal flux consistency, excellent wetting, and clean solder joint formation.
- Generous 50g Capacity: Supplied in a secure container for extended workshop use and multiple projects.
- Versatile Application: Ideal for PCB assembly, rework, mobile phone logic board repair, and microelectronics.
Technical Specifications
- Brand: PPD
- Model: S260
- Melting Point: 138°C
- Capacity/Weight: 50g
- Application: Low-Temperature Micro-Soldering & BGA Reballing
Data
Weight:
75 g/pcs
