Mechanic DW50 138°C 50g Low-Temperature Solder Paste
9.99 £
Mechanic DW50 138°C 50g Low-Temperature Solder Paste
In stock
9.99 £
Brand:
Mechanic
- Low-Temperature 138°C: Ideal for sensitive components and layered smartphone motherboard repairs without thermal damage.
- Smooth Consistency: Formulated for precision BGA reballing, fine-pitch stencil printing, and reliable wetting.
- 50g Capacity: Generous jar size designed for professional electronics repair workshops and technicians.
Details
Please Note: The pictures are for illustration purposes only.
Mechanic DW50 138°C 50g Low-Temperature Solder Paste
Boost your micro-soldering precision and efficiency with the Mechanic DW50 138°C 50g Low-Temperature Solder Paste. Engineered for heat-sensitive electronics, this premium paste provides reliable performance at a precise low melting point of 138°C, making it indispensable for complex tasks such as smartphone motherboard repairs and delicate BGA reballing.
Key Features
- Optimal Low Melting Point: Operates safely at 138°C, drastically reducing the risk of warping, delamination, or IC failure on delicate circuit boards.
- Professional Grade Viscosity: Ensures smooth application, even paste distribution, and bright, full solder joints without bridging.
- Generous 50g Capacity: Supplied in a secure container to maintain freshness and prevent oxidation during extended workshop use.
- Versatile Application: Perfect for PCB assembly, smartphone logic board repair, and fine-pitch SMD/BGA rework.
Technical Specifications
- Brand: Mechanic
- Model: DW50
- Melting Point: 138°C
- Capacity/Weight: 50g
- Application: Low-Temperature Micro-Soldering & BGA Reballing
Data
Weight:
75 g/pcs
