XZZ L2023 iPhone Pre-Heating Station X-14 Series

Please Note: Pictures are for illustration purposes only.

XZZ L2023 iPhone Logic Board Pre-Heating Station

Upgrade your micro-soldering capabilities with the XZZ L2023 Universal Pre-Heating Station, engineered specifically for iPhone double-decker motherboard separation, chip desoldering, and reballing. Supporting iPhone models from X through 14 Pro Max, this all-in-one heating platform provides fast, uniform heat distribution to safely split layered PCBs without thermal stress.

Equipped with intelligent temperature management, the XZZ L2023 maintains accurate thermal levels, safeguarding delicate surface-mounted ICs and CPU logic circuits. Its modular surface design and compact workbench footprint make it an essential heating station for professional mobile repair technicians and micro-soldering labs.

Key Features:

• Wide iPhone Compatibility: Modular pre-heating platform supports iPhone X, XS, 11, 12, 13, and 14 series motherboards.
• Precise Thermal Management: Even heat distribution ensures clean, risk-free separation of upper and lower board layers.
• Intelligent Temperature Regulation: Maintains optimal heat levels without overheating or scorching PCB substrates.
• Component & Trace Protection: Reduces required hot air rework temperatures, protecting surrounding chips from heat degradation.
• Durable Workbench Build: Premium heat-resistant alloy construction designed for daily professional repair shop use.