Wylie WL-01 Display IC BGA Reballing Stencil for iPhone 6-12 Series
6.49 £
Wylie WL-01 Display IC BGA Reballing Stencil for iPhone 6-12 Series
In stock
6.49 £
Brand:
Wylie
- iPhone 6 to 12 Series Coverage: Multi-model matrix designed for reballing display ICs, touch ICs, and screen flex chips across iPhone 6 to 12 series.
- Heat-Resistant Japanese Stainless Steel: Precision laser-cut stencil engineered to resist warping and bulging under high-temperature hot air reflow.
- Anti-Bridging Square Apertures: Precision rounded-corner cutouts ensure uniform solder paste release and prevent short circuits.
Details
Wylie WL-01 Display IC BGA Reballing Stencil for iPhone 6–12 Series
Streamline display IC swaps and touch controller repairs across multiple iPhone generations with the Wylie WL-01 Display IC BGA Reballing Stencil. Specially engineered for professional micro-soldering technicians, this high-precision stencil covers display-related integrated circuits from iPhone 6 up to iPhone 12 Pro Max.
Key Features & Performance
- Broad iPhone Model Compatibility: Features precise cutout matrices covering display ICs, touch ICs, and screen flex chips for iPhone 6, 6s, 7, 8, X, XR, XS, 11, and 12 series.
- High-Grade Japanese Steel: Constructed from premium heat-resistant stainless steel to maintain complete flatness and stability during hot air reflow.
- Clean Solder Paste Release: CNC laser-etched square cutouts with rounded internal corners facilitate smooth, predictable solder paste application without bridging.
- Microscope Alignment Guides: Etched position grids provide high contrast and clear visibility under microscope magnification for rapid IC alignment.
Applications
- iPhone 6 to 12 Series Screen & Display Flex Repair
- Display Driver IC, Touch IC & Backlight Controller Reballing
- Screen Swap IC Transfer & Logic Board Rework
Data
Weight:
40 g/pcs
