Wylie WL-009H 0.009mm Non-Insulated Silver Micro Jumper Wire 200m
6.49 £
Wylie WL-009H 0.009mm Non-Insulated Silver Micro Jumper Wire 200m
In stock
6.49 £
Brand:
Wylie
MPN:
WL-009H (WLWL009HNI)
- Ultra-Fine 0.009mm Gauge: Sub-micron 9-micron silver wire engineered for high-density micro-soldering and trace repair under a microscope.
- Bare Non-Insulated Surface: Requires no insulation stripping or scraping—solder tins instantly for direct pad bonding and trace bridging.
- 99.9% Pure Silver Conductive Alloy: Provides superior electrical conductivity, low impedance, and high tensile strength for logic board repairs.
Details
Professional 0.009mm Non-Insulated Silver Micro-Jumper Wire
The Wylie WL-009H 0.009mm Non-Insulated Silver Jumper Wire is an indispensable consumable engineered specifically for micro-soldering technicians, BGA reballing specialists, and smartphone repair engineers. Crafted from high-purity silver alloy, this sub-micron 0.009mm bare wire delivers exceptional conductivity and tensile strength for restoring microscopic circuit traces and BGA solder pads.
Key Specifications & Benefits
- Sub-Micron Micro Trace Repair: Ultra-thin 0.009mm (9-micron) gauge fits easily between microscopic IC pins, BGA solder balls, and delicate multi-layer PCB lines.
- Bare Conductive Wire: Eliminates time-consuming insulation stripping—solder adheres immediately to the bare silver surface for rapid, clean solder connections.
- 99.9% Pure Silver Alloy Core: Delivers maximum electrical conductivity, minimal resistance, and exceptional signal integrity for modern smartphone logic board repairs.
- High Tensile & Stretch Resistance: Flexible silver alloy resists snapping, curling, or tearing under precision tweezers during intricate flyline soldering.
- Universal PCB Application: Essential tool for fixing iPhone Face ID trace bridges, Android motherboard broken tracks, laptop logic boards, and smartwatch circuitry.
Technical Specifications
- Model SKU: WLWL009HNI
- MPN: WL-009H
- Product Type: Bare Non-Insulated Micro-Jumper Wire (Flyline)
- Wire Diameter: 0.009 mm (9 Micron)
- Material: High-Purity Silver Alloy
- Insulation Status: Non-Insulated (Bare Wire)
- Spool Length: Approx. 200 Metres
- Application: Logic Board Trace Repair, BGA Pad Bridging & Micro-Flyline Soldering
Data
Weight:
50 g/pcs
