Wylie WL-007H 0.007mm Insulated Silver Micro Jumper Wire 200m
7.49 £
Wylie WL-007H 0.007mm Insulated Silver Micro Jumper Wire 200m
In stock
7.49 £
Brand:
Wylie
MPN:
WL-007H (WLWL007HI)
- Ultra-Fine 0.007mm Diameter: Sub-micron 7-micron silver wire engineered for microscopic PCB trace repairs and BGA pad flyline jumpers.
- Enameled Insulation Coating: Prevents accidental short circuits when crossing over adjacent components, traces, or multiple jumper wires.
- 99.9% Pure Silver Conductive Core: Delivers superior electrical performance, minimal resistance, and high tensile strength for logic board repairs.
Details
Professional 0.007mm Insulated Silver Micro-Jumper Wire
The Wylie WL-007H 0.007mm Insulated Silver Jumper Wire is an ultra-fine micro-soldering consumable engineered specifically for advanced PCB technicians, BGA reballing specialists, and smartphone repair engineers. Featuring an ultra-thin 0.007mm high-purity silver core wrapped in a protective insulating enamel coating, this 7-micron flyline enables seamless circuit restoration on ultra-high-density micro-electronics without risking accidental short circuits.
Key Specifications & Benefits
- Ultra-Fine Sub-0.01mm Trace Repair: Microscopic 0.007mm diameter fits between ultra-dense BGA solder balls, micro-IC pins, and damaged multi-layer PCB traces.
- Short-Circuit Protective Insulation: Tough insulating enamel coating permits jumper wires to overlap and cross active traces safely without shorting out.
- 99.9% Pure Silver Alloy Core: Offers maximum electrical conductivity, low impedance, and high-frequency signal integrity for modern smartphone logic board repair.
- Exceptional Flexibility & Tensile Strength: Specially treated silver alloy resists snapping, curling, or breaking under tweezers during fine micro-soldering tasks.
- Universal Micro-Electronics Application: Crucial for repairing iPhone Face ID tracks, Android CPU/RAM reballing flylines, MacBook logic board traces, and smartwatch circuitry.
Technical Specifications
- Model SKU: WLWL007HI
- MPN: WL-007H
- Product Type: Insulated Micro-Jumper Wire (Flyline)
- Wire Diameter: 0.007 mm (7 Micron)
- Material: High-Purity Silver Alloy with Insulating Enamel
- Insulation Status: Insulated (Enameled Coating)
- Spool Length: Approx. 200 Metres
- Application: Ultra-Fine Logic Board Trace Repair, BGA Pad Bridging & Micro-Flyline Soldering
Data
Weight:
50 g/pcs
