WL Black BGA Reballing Stencil for iPhone 11 Series
7.49 £
WL Black BGA Reballing Stencil for iPhone 11 Series
In stock
7.49 £
Brand:
WL
- iPhone 11 Series Compatibility: Custom-engineered BGA reballing stencil covering iPhone 11, 11 Pro, and 11 Pro Max logic board IC rework.
- Black Anti-Glare Heat-Resistant Steel: High-grade steel with black anti-reflection finish to reduce eye strain under microscope lighting and resist thermal deformation.
- Anti-Bridging Square Apertures: Precision rounded-corner cutouts ensure uniform solder paste release and prevent short circuits.
Details
WL Black BGA Reballing Stencil for iPhone 11 Series
Upgrade your iPhone logic board repair capabilities with the WL Black BGA Reballing Stencil. Specially engineered for professional micro-soldering technicians, this high-precision stencil delivers accurate alignment and clean solder paste release for reballing integrated circuits on iPhone 11, 11 Pro, and 11 Pro Max motherboards.
Key Features & Performance
- Dedicated iPhone 11 Grid Matrix: Accurate cutout placement for A13 Bionic CPU, PMIC, Baseband, Audio IC, NAND flash, and middle board interposer components.
- Black Anti-Glare Coating: Specialized dark finish reduces reflection under bench microscopes while maintaining thermal resistance during hot air reflow.
- Clean Solder Paste Release: CNC laser-etched square cutouts with rounded internal corners facilitate smooth, predictable solder paste application without bridging.
- Microscope Alignment Markings: High-contrast etched guides ensure exact IC positioning under microscope magnification.
Applications
- iPhone 11 / 11 Pro / 11 Pro Max Board-Level Micro-Soldering
- Double-Decker Logic Board Reballing & Re-Joining
- Power Management IC, Baseband & A13 CPU Rework
Data
Weight:
40 g/pcs
