RELIFE SP-X 158°C Solder Paste 50g Jar

Professional 158°C Medium-Temperature Solder Paste for Micro-Soldering

The RELIFE SP-X 158°C 50g Soldering Paste is a high-grade, medium-temperature lead-free solder paste formulated specifically for micro-soldering technicians, PCB repair specialists, and smartphone refurbishing engineers. Engineered with a balanced melting threshold of 158°C, this solder paste provides the perfect middle ground between low-temp tin-bismuth pastes and high-temp 183°C/217°C alloys, preventing thermal damage to sensitive logic board ICs during rework.

Key Specifications & Benefits

• Targeted 158°C Melting Point: Ideal for double-stacked iPhone logic board middle frame layering, CPU/A-series chip reballing, and delicate SMD component installation where standard high heat could delaminate the board.
• Bright & Durable Solder Joints: Produces uniform, low-void solder spheres with superior mechanical bond strength and electrical conductivity, resisting cracking from physical shock.
• Optimal Viscosity & Fine Grain: Smooth, non-clumping paste consistency spreads evenly across high-density BGA stencils without bridging or smearing.
• Low Residue & Minimal Splatter: Clean-burning formula minimizes post-soldering flux residue, reducing the need for aggressive PCB cleaning solvents.
• Anti-Oxidation Formula: Formulated to maintain stable performance and extended shelf life under workshop conditions without rapid drying out.

Technical Specifications

• Model SKU: RLRLSPX50
• MPN: SP-X / SPX
• Product Type: Medium-Temperature Solder Paste
• Melting Temperature: 158°C
• Weight Capacity: 50g Jar
• Alloy Composition: Lead-Free Medium Temp Alloy
• Application Method: BGA Stencil Printing & Micro Syringe Dispensing
• Primary Application: Mobile Phone Motherboard Layering, BGA IC Reballing & PCB Rework