ReLife RL-601T 18in1 iPhone Reballing Set

Please Note: Pictures are for illustration purposes only. Solder paste sold separately.

ReLife RL-601T 18-in-1 iPhone Mid-Layer Reballing Stencil Set

Streamline complex smartphone micro-soldering tasks with the ReLife RL-601T 18-in-1 Middle Frame Reballing Stencil Platform Set. Engineered specifically for professional mobile repair technicians, this comprehensive fixture simplifies the reballing and resoldering of double-layered (sandwich) logic boards across multiple iPhone generations.

Featuring a durable synthetic stone fixture base and strong positioning magnets, the RL-601T securely aligns high-precision steel stencils over motherboard interposer pads. Its anti-warping, heat-resistant construction ensures clean solder paste deposition and uniform ball formation during hot-air reflow rework.

Key Performance Features:

• Extensive iPhone Compatibility: Covers middle-frame reballing for iPhone X, XS, XS Max, XR, 11, 11 Pro, 11 Pro Max, 12, 12 Mini, 12 Pro, 12 Pro Max, 13, 13 Mini, 13 Pro, 13 Pro Max, 14, 14 Plus, 14 Pro, and 14 Pro Max.
• Magnetic Precision Lock: Powerful magnets keep stencils firmly seated to prevent solder paste bleed and pad bridging.
• Heat-Resistant Synthetic Stone: Non-conductive base material insulates heat and withstands continuous hot-air gun application.
• Laser-Cut Precision Stencils: Ultra-smooth aperture walls facilitate effortless stencil release and perfect BGA solder ball height.
• Essential Board Repair Tool: Ideal for restoring damaged logic board interposers, signal connections, and power rails.