Relife RL-101B 8-in-1 CPU IC Underfill Glue Remover Set

Professional 8-in-1 Micro-Soldering Glue Scraping Tool Kit

The Relife RL-101B 8 in 1 CPU/IC Chip Underfill Glue Remover Tool Set is an essential micro-soldering kit designed for mobile repair technicians, board-level service engineers, and micro-electronics specialists. Precision-milled from high-hardness alloy steel, this 8-piece blade set enables effortless removal of tough black resin, frame glue, and CPU/NAND underfill adhesive on smartphone motherboards.

Key Specifications & Benefits

• Eight Versatile Blade Shapes: Includes sickle, hook, scraper, and flat edge profiles engineered specifically for delicate BGA IC chip cleaning and edge glue slicing.
• Trace-Safe Micro-Milling: Flexible blade geometry allows smooth scraping under surface-mount ICs and BGA chips without scratching solder mask or severing internal logic board traces.
• Hot Air Rework Station Compatible: Engineered to withstand direct high-temperature hot air exposure during underfill softening and IC desoldering.
• Ergonomic Anodised Handle: Non-slip aluminium handle with secure chuck collet provides maximum tactile control for delicate micro-repairs under a microscope.
• Resilient & Wear-Resistant: Premium alloy steel construction maintains sharp, flexible edges through repeated scraping cycles on hardened adhesive.

Technical Specifications

• Model: Relife RL-101B (RLRL101B)
• Product Type: CPU / IC Chip Underfill Glue Remover Blade Set
• Set Count: 8-in-1 Blade Kit with Handle
• Material: Hand-Finished High-Hardness Alloy Steel & Aluminium Handle
• Thermal Resistance: High-Temperature Hot Air Rework Safe
• Application: BGA IC Scraping, CPU/NAND Underfill Removal, Frame Glue Cleaning