ReLife RL-044 Display IC BGA Reballing Stencil for iPhone 11-13 Series
18.99 £
ReLife RL-044 Display IC BGA Reballing Stencil for iPhone 11-13 Series
In stock
18.99 £
Brand:
ReLife
- iPhone 11 to 13 Series Coverage: Dedicated multi-model matrix designed for reballing display screen ICs, touch ICs, and flex chips across iPhone 11, 12, and 13 series.
- Heat-Resistant Japanese Stainless Steel: Precision laser-cut stencil engineered to prevent warping, flexing, and bulging under hot air reflow.
- Anti-Bridging Square Apertures: CNC laser-etched square cutouts with rounded corners ensure uniform solder paste release and prevent short circuits.
Details
ReLife RL-044 Display IC BGA Reballing Stencil for iPhone 11 to 13 Series
Streamline screen display IC swaps and touch controller repairs with the ReLife RL-044 Display IC BGA Reballing Stencil. Specially engineered for professional micro-soldering technicians and mobile repair specialists, this precision stencil covers display-related integrated circuits across iPhone 11, 12, and 13 series logic boards.
Key Features & Performance
- Broad iPhone Model Compatibility: Features precise cutout matrices covering display ICs, touch ICs, and screen flex chips for iPhone 11, 12, and 13 series (including Mini, Pro, and Pro Max models).
- High-Grade Japanese Steel: Constructed from premium heat-resistant stainless steel to maintain complete flatness and stability during high-temperature hot air reflow.
- Clean Solder Paste Release: Laser-etched square cutouts with rounded internal corners facilitate smooth, predictable solder paste application without bridging.
- Microscope Alignment Guides: Etched position grids provide high contrast and clear visibility under microscope magnification for rapid IC alignment.
Applications
- iPhone 11 / 12 / 13 Series Display & Screen Flex Repair
- Display Driver IC, Touch IC & Backlight Controller Reballing
- Screen Swap IC Transfer & Logic Board Rework
Data
Weight:
40 g/pcs
