ReLife RL-044 BGA Reballing Stencil for iPhone 15 Series
7.49 £
ReLife RL-044 BGA Reballing Stencil for iPhone 15 Series
In stock
7.49 £
Brand:
ReLife
- iPhone 15 Series Compatibility: Custom-engineered BGA reballing stencil covering iPhone 15, 15 Plus, 15 Pro, and 15 Pro Max logic board IC rework.
- Heat-Resistant Japanese Stainless Steel: Precision laser-cut stencil resists warping, flexing, and bulging under high hot air temperatures.
- Anti-Bridging Square Apertures: Precision rounded-corner cutouts ensure uniform solder paste release and prevent solder ball bridging.
Details
ReLife RL-044 BGA Reballing Stencil for iPhone 15 Series
Upgrade your iPhone logic board repair capabilities with the ReLife RL-044 BGA Reballing Stencil. Specially engineered for professional micro-soldering technicians, this high-precision stencil delivers accurate alignment and clean solder paste release for reballing integrated circuits on iPhone 15, 15 Plus, 15 Pro, and 15 Pro Max motherboards.
Key Features & Performance
- Dedicated iPhone 15 Grid Matrix: Accurate cutout placement for A16/A17 Pro Bionic CPUs, PMIC, Baseband, Audio IC, NAND flash, and middle board interposer components.
- High-Grade Japanese Steel: Constructed from heat-resistant stainless steel to maintain complete flatness and stability during hot air reflow.
- Clean Solder Paste Release: CNC laser-etched square cutouts with rounded internal corners facilitate smooth, predictable solder paste application without bridging.
- Microscope Alignment Markings: Crisp etched guides ensure exact IC positioning under microscope magnification.
Applications
- iPhone 15 / 15 Plus / 15 Pro / 15 Pro Max Board-Level Micro-Soldering
- Double-Decker Logic Board Reballing & Re-Joining
- Power Management IC, Baseband & CPU Rework
Data
Weight:
40 g/pcs
