ReLife RL-044 BGA Reballing Stencil for iPhone 13 Series
6.99 £
ReLife RL-044 BGA Reballing Stencil for iPhone 13 Series
In stock
6.99 £
Brand:
ReLife
- iPhone 13 Series Compatibility: Custom-engineered BGA reballing stencil covering iPhone 13, 13 Mini, 13 Pro, and 13 Pro Max logic board IC rework.
- Heat-Resistant Japanese Stainless Steel: Precision laser-cut stencil resists warping, flexing, and bulging under high hot air temperatures.
- Anti-Bridging Square Apertures: Precision rounded-corner cutouts ensure uniform solder paste release and prevent solder ball bridging.
Details
ReLife RL-044 BGA Reballing Stencil for iPhone 13 Series
Upgrade your iPhone logic board repair capabilities with the ReLife RL-044 BGA Reballing Stencil. Specially engineered for professional micro-soldering technicians, this high-precision stencil delivers accurate alignment and clean solder paste release for reballing integrated circuits on iPhone 13, 13 Mini, 13 Pro, and 13 Pro Max motherboards.
Key Features & Performance
- Dedicated iPhone 13 Grid Matrix: Accurate cutout placement for A15 Bionic CPU, PMIC, Baseband, Audio IC, NAND flash, and middle board interposer components.
- High-Grade Japanese Steel: Constructed from heat-resistant stainless steel to maintain complete flatness and stability during hot air reflow.
- Clean Solder Paste Release: CNC laser-etched square cutouts with rounded internal corners facilitate smooth, predictable solder paste application without bridging.
- Microscope Alignment Markings: Crisp etched guides ensure exact IC positioning under microscope magnification.
Applications
- iPhone 13 / 13 Mini / 13 Pro / 13 Pro Max Board-Level Micro-Soldering
- Double-Decker Logic Board Reballing & Re-Joining
- Power Management IC, Baseband & A15 CPU Rework
Data
Weight:
40 g/pcs
