Relife RL-039 20ml BGA IC Chip Epoxy Underfill Remover Liquid

Professional BGA IC Underfill Softening Solvent

The Relife RL-039 Underfill Remover Aid (20ml) is a specialised chemical softening fluid engineered for mobile service technicians, micro-soldering specialists, and PCB repair engineers. Formulated to target tough factory epoxy encapsulation, RL-039 rapidly breaks down hardened underfill resin surrounding BGA chips, CPUs, power ICs, and NAND flash memory on smartphone and tablet logic boards.

Key Specifications & Benefits

• Targeted Chemical Softening: Easily penetrates narrow gaps beneath integrated circuits to soften black, white, and transparent epoxy underfill without requiring aggressive mechanical scraping.
• Protects Delicate Logic Boards: Non-corrosive chemical composition safeguards underlying copper solder pads, trace wiring, and green/black PCB mask layers against chemical etching.
• Reduces Thermal & Mechanical Stress: Dramatically lowers the heat level and prying force needed to remove chips, helping to prevent torn solder pads or cracked CPU dies.
• Compact & Waste-Free Bottle: The 20ml container is designed for precision work, enabling easy application via fine brush or dispenser needle.
• Universal Logic Board Compatibility: Essential tool for servicing Apple iPhone, iPad, Samsung Galaxy, and Android smartphone logic boards.

Technical Specifications

• Model: Relife RL-039
• Product Type: BGA IC Underfill Softening & Removal Fluid
• Volume: 20ml
• Target Material: Epoxy Resin / Polyurethane Underfill
• Chemical Properties: High-Permeability Non-Corrosive Solvent
• Application: BGA, IC, CPU & NAND Chip Refurbishment

Usage & Safety Guidelines

Apply a small drop directly along the chip perimeter. Allow the solvent to penetrate for 1 to 2 minutes, then apply mild hot air (approx. 150°C–200°C) to scrape away the softened underfill using a non-scratch pry blade or dental pick. Always use in a well-ventilated workshop environment.