Qianli Mega-Idea 0.3-0.5mm Pitch Universal BGA Stencil
7.49 £
Qianli Mega-Idea 0.3-0.5mm Pitch Universal BGA Stencil
In stock
7.49 £
Brand:
Qianli Mega-Idea
- Universal 0.3–0.5mm Pitch Grid: Covers 0.3mm, 0.35mm, 0.4mm, 0.45mm, and 0.5mm IC pin pitches for universal micro-soldering repairs.
- Heat-Resistant Stainless Steel: Manufactured from high-grade Japanese steel that maintains flatness under direct hot air reflow.
- Anti-Bridging Apertures: Precision laser-cut rounded square cutouts ensure uniform solder paste release and prevent short circuits.
Details
Qianli Mega-Idea 0.3–0.5mm Pitch Universal BGA Reballing Stencil
Simplify multi-chip micro-soldering and logic board repair with the Qianli Mega-Idea Universal BGA Stencil. Designed for versatility across a wide range of electronic components, this stencil features multi-pitch grid matrices ranging from 0.3mm to 0.5mm, making it an essential tool for reballing unknown ICs, PMICs, audio chips, and small SMD packages.
Key Features & Performance
- Multi-Pitch Matrix Coverage: Integrated grid areas dedicated to 0.3mm, 0.35mm, 0.4mm, 0.45mm, and 0.5mm pin distances.
- High-Grade Japanese Stainless Steel: Engineered to withstand intense benchtop soldering heat without bulging, warping, or distorting.
- Clean Solder Paste Release: CNC laser-etched square cutouts with rounded internal corners facilitate smooth, predictable solder paste application without bridging.
- Microscope Alignment Markings: High-contrast etched grids provide exceptional visibility under microscope magnification for rapid positioning.
Applications
- Universal Smartphone & Tablet BGA IC Reballing
- PMIC, Audio Codec, Controller IC & SMD Component Repair
- Logic Board Micro-Soldering Rework
Data
Weight:
40 g/pcs
