Qianli BumbleBee BGA Reballing Stencil for iPhone XR XS Series
7.49 £
Qianli BumbleBee BGA Reballing Stencil for iPhone XR XS Series
In stock
7.49 £
Brand:
Qianli
- iPhone XR/XS Series Compatibility: Custom-engineered BGA reballing stencil covering iPhone XR, XS, and XS Max logic board IC rework.
- Black Anti-Glare Heat-Resistant Steel: Durable high-grade steel with anti-reflection coating that resists warping and bulging under high hot air temperatures.
- Anti-Bridging Square Apertures: Precision laser-cut square rounded-corner cutouts ensure clean solder paste release and prevent short circuits.
Details
Qianli BumbleBee BGA Reballing Stencil for iPhone XR & XS Series
Upgrade your iPhone logic board repair capabilities with the Qianli BumbleBee BGA Reballing Stencil. Specially engineered for professional micro-soldering technicians, this high-precision stencil delivers accurate alignment and clean solder paste release for reballing integrated circuits on iPhone XR, XS, and XS Max motherboards.
Key Features & Performance
- Dedicated iPhone XR/XS Grid Matrix: Accurate cutout placement for A12 Bionic CPU, PMIC, Baseband, Audio IC, NAND flash, and middle board interposer components.
- Black Anti-Glare Coating: Distinctive BumbleBee series black finish reduces glare under microscope lighting while maintaining high thermal resistance during hot air reflow.
- Clean Solder Paste Release: CNC laser-etched square cutouts with rounded internal corners facilitate smooth, predictable solder paste application without bridging.
- Microscope Alignment Markings: High-contrast etched guides ensure clear visibility and exact IC positioning under microscope magnification.
Applications
- iPhone XR / XS / XS Max Board-Level Micro-Soldering
- Double-Decker Logic Board Reballing & Re-Joining
- Power Management IC, Baseband & A12 CPU Rework
Data
Weight:
40 g/pcs
