Qianli BumbleBee BGA Reballing Stencil for iPhone 11 Series
7.49 £
Qianli BumbleBee BGA Reballing Stencil for iPhone 11 Series
In stock
7.49 £
Brand:
Qianli
- iPhone 11 Series Compatibility: Custom-engineered BGA reballing stencil covering iPhone 11, 11 Pro, and 11 Pro Max logic board IC rework.
- Black Anti-Glare Heat-Resistant Steel: Durable high-grade steel with anti-reflection coating that resists warping and bulging under high hot air temperatures.
- Anti-Bridging Square Apertures: Precision laser-cut square rounded-corner cutouts ensure clean solder paste release and prevent short circuits.
Details
Qianli BumbleBee BGA Reballing Stencil for iPhone 11 Series
Upgrade your iPhone logic board repair capabilities with the Qianli BumbleBee BGA Reballing Stencil. Specially engineered for professional micro-soldering technicians, this high-precision stencil delivers accurate alignment and clean solder paste release for reballing integrated circuits on iPhone 11, 11 Pro, and 11 Pro Max motherboards.
Key Features & Performance
- Dedicated iPhone 11 Grid Matrix: Accurate cutout placement for A13 Bionic CPU, PMIC, Baseband, Audio IC, NAND flash, and middle board interposer components.
- Black Anti-Glare Coating: Distinctive BumbleBee series black finish reduces glare under microscope lighting while maintaining high thermal resistance during hot air reflow.
- Clean Solder Paste Release: CNC laser-etched square cutouts with rounded internal corners facilitate smooth, predictable solder paste application without bridging.
- Microscope Alignment Markings: High-contrast etched guides ensure clear visibility and exact IC positioning under microscope magnification.
Applications
- iPhone 11 / 11 Pro / 11 Pro Max Board-Level Micro-Soldering
- Double-Decker Logic Board Reballing & Re-Joining
- Power Management IC, Baseband & A13 CPU Rework
Data
Weight:
40 g/pcs
