Qianli 10in1 iPhone Mid Frame Reballing Platform
10-in-1 Magnetic Reballing Platform for iPhone Logic Board Mid-Frames
- 10-in-1 Multi-Model Support: Compatible with double-stacked sandwich logic boards from iPhone X up to iPhone 12 Pro Max.
- Magnetic Positioning Base: Strong integrated magnets hold steel stencils in precise alignment for solder paste application.
- High Thermal Stability: Synthetic stone fixture and laser-cut stainless steel stencils resist high heat without warping.
Please Note: Pictures are for illustration purposes only. Solder paste sold separately.
Qianli 10in1 iPhone Mid-Layer Reballing Stencil Platform
Streamline complex smartphone micro-soldering tasks with the Qianli 10in1 Middle Frame Reballing Stencil Platform. Engineered specifically for professional mobile repair technicians, this comprehensive fixture simplifies the reballing and resoldering of double-layered (sandwich) logic boards across multiple iPhone generations.
Featuring a durable synthetic stone fixture base and strong positioning magnets, the platform securely aligns high-precision steel stencils over motherboard interposer pads. Its anti-warping, heat-resistant construction ensures clean solder paste deposition and uniform ball formation during hot-air reflow rework.
Key Performance Features:
- Wide iPhone Compatibility: Covers middle-frame reballing for iPhone X, XS, XS Max, XR, 11, 11 Pro, 11 Pro Max, 12, 12 Mini, 12 Pro, and 12 Pro Max.
- Magnetic Precision Lock: Powerful magnets keep stencils firmly seated to prevent solder paste bleed and pad bridging.
- Heat-Resistant Synthetic Stone: Non-conductive base material insulates heat and withstands continuous hot-air gun application.
- Laser-Cut Precision Stencils: Ultra-smooth aperture walls facilitate effortless stencil release and perfect BGA solder ball height.
- Essential Board Repair Tool: Ideal for restoring damaged logic board interposers, signal connections, and power rails.