MiJing iRepair HY258 10cc SMT Flux Kit
Out of stock
8.49 £
Brand:
MiJing
Out of stock
10cc No-Clean SMT Solder Flux Syringe Kit
- Special SMT Formulation: Delivers superior wetting action and heat transfer for precise SMT rework and BGA reballing.
- Non-Conductive Formula: Leaves minimal, non-corrosive residue preventing electrical short circuits on fine-pitch traces.
- Complete Syringe Kit: Includes a syringe plunger and dispensing needle for controlled micro-dosing on dense circuitry.
Details
Please Note: Pictures are for illustration purposes only. Includes syringe plunger and dispensing tip.
MiJing iRepair Special SMT Soldering Flux HY258 10cc
Achieve clean, high-reliability solder joints with the MiJing iRepair Special SMT Soldering Flux HY258 10cc. Engineered specifically for micro-soldering technicians and smartphone repair specialists, this high-performance SMT flux gel provides excellent thermal transfer and oxidation resistance during delicate board-level repairs.
The HY258 flux gel features a no-clean, non-conductive formula that promotes smooth solder wetting across fine-pitch SMT pads, BGA array chips, and SMD components. Its precise syringe packaging enables controlled application directly onto target areas, reducing waste and minimizing cleanup time.
Key Performance Features:
- Superior SMT Wetting Performance: Accelerates solder flow and prevents bridging on high-density logic boards.
- Non-Conductive & No-Clean: Dries to a clear, non-corrosive finish that eliminates electrical leakage risks.
- High Thermal Stability: Prevents premature drying and oxidation under continuous hot-air rework temperatures.
- Precision Syringe Delivery: Allows accurate dispensing on tiny BGA array pads and micro jumper wires.
- Wide Application Range: Ideal for logic board repair on iPhones, Android devices, laptops, and consumer electronics.
Data
Weight:
60 g/pcs
