MiJing Z21 Max iPhone CPU Reballing Platform

Please Note: Pictures are for illustration purposes only. Solder paste sold separately.

MiJing Z21 Max 11-in-1 iPhone CPU Reballing Stencil Platform

Achieve flawless processor repair and reballing with the MiJing Z21 Max 11-in-1 CPU Reballing Stencil Platform. Engineered specifically for professional mobile phone technicians and micro-soldering specialists, this fixture provides ultra-precise alignment for servicing Apple A-series CPUs across multiple iPhone generations.

Built with a high-temperature synthetic stone base and an integrated double-magnet positioning system, the Z21 Max holds laser-cut steel stencils securely flush against the IC face. The black-coated stencil mesh features square apertures with rounded internal corners, ensuring smooth solder paste deposition, zero tin-beading, and effortless stencil release after reflow.

Key Performance Features:

• Wide CPU Compatibility: Supports Apple A8, A9, A10, A11, A12, A13, A14, A15, A16, A17, and A18 processor reballing.
• Super-Magnetic Fixture: Dual magnets prevent stencil shift during solder paste scraping for exact pad alignment.
• Thermal & Wear Resistance: High-density synthetic stone withstands direct hot-air reflow heat without warping.
• Burr-Free Mesh Design: Precision-etched apertures eliminate stuck tin balls and ensure uniform BGA ball height.
• Flexible Steel Stencils: Premium steel construction allows moderate bending while returning perfectly to shape.