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MiJing Z20 Pro iPhone Reballing Platform
MiJing Z20 Pro iPhone Reballing Platform
84.99 £
  1. Reballing Platforms
  1. PCB / BGA / Logic Board
  2. Reballing Platforms

MiJing Z20 Pro iPhone Reballing Platform

MiJing Z20 Pro iPhone Reballing Platform
MiJing Z20 Pro iPhone Reballing Platform
MiJing Z20 Pro iPhone Reballing Platform
MiJing Z20 Pro iPhone Reballing Platform
MiJing Z20 Pro iPhone Reballing Platform
MiJing Z20 Pro iPhone Reballing Platform
MiJing Z20 Pro iPhone Reballing Platform
MiJing Z20 Pro iPhone Reballing Platform
MiJing Z20 Pro iPhone Reballing Platform
MiJing Z20 Pro iPhone Reballing Platform
MiJing Z20 Pro iPhone Reballing Platform
MiJing Z20 Pro iPhone Reballing Platform
MiJing Z20 Pro iPhone Reballing Platform
MiJing Z20 Pro iPhone Reballing Platform
MiJing Z20 Pro iPhone Reballing Platform
MiJing Z20 Pro iPhone Reballing Platform
MiJing Z20 Pro iPhone Reballing Platform
MiJing Z20 Pro iPhone Reballing Platform
In stock
84.99 £
Brand:
MiJing

28-in-1 Magnetic Reballing Platform for iPhone Logic Board Mid-Frames

  • 28-in-1 Multi-Model Support: Compatible with double-stacked sandwich logic boards from iPhone X up to iPhone 16 Pro Max.
  • Magnetic Positioning Base: Strong integrated magnets hold steel stencils in precise alignment for solder paste application.
  • High Thermal Stability: Synthetic stone fixture and laser-cut stainless steel stencils resist high heat without warping.
Details

Please Note: Pictures are for illustration purposes only. Solder paste sold separately.

MiJing Z20 Pro 28-in-1 iPhone Mid-Layer Reballing Stencil Platform

Streamline complex smartphone micro-soldering tasks with the MiJing Z20 Pro 28-in-1 Middle Layer Reballing Stencil Platform. Engineered specifically for professional mobile repair technicians, this comprehensive fixture simplifies the reballing and resoldering of double-layered (sandwich) logic boards across multiple iPhone generations.

Featuring a durable synthetic stone fixture base and strong positioning magnets, the Z20 Pro securely aligns high-precision steel stencils over motherboard interposer pads. Its anti-warping, heat-resistant construction ensures clean solder paste deposition and uniform ball formation during hot-air reflow rework.

Key Performance Features:

  • Extensive iPhone Compatibility: Covers middle-frame reballing for iPhone X, XS, XS Max, XR, 11, 11 Pro, 11 Pro Max, 12, 12 Mini, 12 Pro, 12 Pro Max, 13, 13 Mini, 13 Pro, 13 Pro Max, 14, 14 Plus, 14 Pro, 14 Pro Max, 15, 15 Plus, 15 Pro, 15 Pro Max, 16, 16 Plus, 16 Pro, and 16 Pro Max.
  • Magnetic Precision Lock: Powerful magnets keep stencils firmly seated to prevent solder paste bleed and pad bridging.
  • Heat-Resistant Synthetic Stone: Non-conductive base material insulates heat and withstands continuous hot-air gun application.
  • Laser-Cut Precision Stencils: Ultra-smooth aperture walls facilitate effortless stencil release and perfect BGA solder ball height.
  • Essential Board Repair Tool: Ideal for restoring damaged logic board interposers, signal connections, and power rails.
Data
Weight:
500 g/pcs
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