MiJing MS1 iPhone Pre-Heating Station X-15 Series

Please Note: Pictures are for illustration purposes only.

MiJing MS1 iPhone Logic Board Pre-Heating Station

Upgrade your micro-soldering capabilities with the MiJing MS1 Universal Pre-Heating Station, engineered specifically for iPhone double-decker motherboard separation, chip desoldering, and reballing. Supporting iPhone models from X all the way through to 15 Pro Max, this versatile modular heating platform provides fast, uniform heat distribution to safely split layered PCBs without thermal stress.

Equipped with intelligent temperature regulation, the MS1 maintains precise heat levels to protect sensitive surface-mounted ICs and CPU logic circuits. Its modular platform design and compact bench footprint make it an indispensable tool for professional repair technicians and board-level rework specialists.

Key Features:

• Wide iPhone Compatibility: Modular pre-heating platform supports iPhone X, XS, 11, 12, 13, 14, and 15 series motherboards.
• Precise Thermal Control: Consistent heat dispersal ensures clean, risk-free separation of upper and lower logic board layers.
• Intelligent Heat Regulation: Maintains optimal temperature levels to prevent PCB warping and component scorching.
• Component & Trace Protection: Reduces the need for high-temperature hot air blowing, protecting surrounding chips.
• Durable Workbench Build: Premium heat-resistant alloy construction built for continuous daily repair shop use.