Mechanic iSMT M249 BGA Reballing Stencil for iPhone 11 Series
7.49 £
Mechanic iSMT M249 BGA Reballing Stencil for iPhone 11 Series
In stock
7.49 £
Brand:
Mechanic
- iPhone 11 Series Compatibility: Custom-engineered BGA reballing matrix designed specifically for iPhone 11, 11 Pro, and 11 Pro Max logic board IC rework.
- Heat-Resistant Japanese Stainless Steel: Precision laser-cut stencil resists warping, flexing, and bulging under high hot air temperatures.
- Anti-Bridging Square Apertures: Precision rounded-corner cutouts ensure uniform solder paste release and prevent solder ball bridging.
Details
Mechanic iSMT M249 BGA Reballing Stencil for iPhone 11 Series
Upgrade your iPhone logic board repair capabilities with the Mechanic iSMT M249 BGA Reballing Stencil. Specially engineered for professional micro-soldering technicians, this high-precision stencil delivers accurate alignment for reballing integrated circuits on iPhone 11, 11 Pro, and 11 Pro Max motherboards.
Key Features & Performance
- Dedicated iPhone 11 Grid Matrix: Accurate cutout placement for A13 Bionic CPU, PMIC, Baseband, Audio IC, NAND flash, and middle board interposer components.
- High-Grade Japanese Steel: Constructed from heat-resistant stainless steel to maintain complete flatness and stability during hot air reflow.
- Clean Solder Paste Release: CNC laser-etched square cutouts with rounded internal corners facilitate smooth solder paste application without bridging.
- Microscope Alignment Markings: Crisp etched guides ensure exact IC positioning under microscope magnification.
Applications
- iPhone 11 / 11 Pro / 11 Pro Max Board-Level Micro-Soldering
- Double-Decker Logic Board Reballing & Re-Joining
- Power Management IC, Baseband & A13 CPU Rework
Data
Weight:
40 g/pcs
