Mechanic iMax 9 PCB NAND Underfill Edge Glue Remover Tips Set

Professional 9-in-1 Micro-Soldering Glue Scraping Blade Set

The Mechanic iMax 9 Tips Set for PCB Rework & NAND Underfill Edge Glue Removal is a comprehensive micro-soldering hand tool kit designed for mobile repair technicians, board-level service engineers, and micro-electronics specialists. Precision-milled from high-hardness alloy steel, this 9-piece blade set enables effortless removal of tough black resin, frame glue, and CPU/NAND underfill adhesive on smartphone motherboards.

Key Specifications & Benefits

• Nine Versatile Blade Profiles: Features nine specialized blade shapes tailored for precise glue slicing, pad cleaning, frame scraping, and chip edge prying.
• Trace-Safe Micro-Milling: Ultra-thin flexible blade edges slide under surface-mount ICs and BGA chips without scratching solder mask or severing internal copper traces.
• Hot Air Station Compatible: Engineered to withstand direct high-temperature hot-air exposure during underfill softening and component desoldering.
• Universal Handle Fitment: Standardized blade shanks fit securely into standard precision scalpel handles and micro-soldering knife holders.
• Resilient & Wear-Resistant: Premium alloy steel construction maintains sharp, flexible edges through repeated scraping cycles on hardened adhesive.

Technical Specifications

• Model: Mechanic iMax 9 (MiMAX9)
• Product Type: PCB Rework & NAND Underfill Glue Remover Blade Set
• Set Count: 9-in-1 Precision Blades
• Material: Hand-Finished High-Hardness Alloy Steel
• Thermal Resistance: High-Temperature Hot Air Rework Safe
• Application: BGA IC Scraping, CPU/NAND Underfill Removal, Frame Glue Cleaning