Mechanic iBGA 13 Max iPhone Reballing Platform

Please Note: Pictures are for illustration purposes only. Solder paste sold separately.

Mechanic iBGA 13 Max 14-in-1 iPhone Mid-Layer Reballing Platform

Streamline complex smartphone micro-soldering tasks with the Mechanic iBGA 13 Max 14-in-1 Middle Layer Reballing Stencil Platform. Engineered specifically for professional mobile repair technicians, this comprehensive fixture simplifies the reballing and resoldering of double-layered (sandwich) logic boards across multiple iPhone generations.

Featuring a durable synthetic stone fixture base and strong positioning magnets, the iBGA 13 Max securely aligns high-precision steel stencils over motherboard contact pads. Its anti-warping, heat-resistant construction ensures clean solder paste deposition and uniform ball formation during hot-air reflow rework.

Key Performance Features:

• Wide iPhone Compatibility: Covers middle-frame reballing for iPhone X, XS, XS Max, 11, 11 Pro, 11 Pro Max, 12, 12 Mini, 12 Pro, 12 Pro Max, 13, 13 Mini, 13 Pro, and 13 Pro Max.
• Magnetic Precision Lock: Powerful magnets keep stencils firmly seated to prevent solder paste bleed and pad bridging.
• Heat-Resistant Synthetic Stone: Non-conductive base material insulates heat and withstands continuous hot-air gun application.
• Laser-Cut Precision Stencils: Ultra-smooth aperture walls facilitate effortless stencil release and perfect BGA solder ball height.
• Essential Board Repair Tool: Ideal for restoring damaged logic board interposers, signal connections, and power rails.