Mechanic UFO WiFi IC BGA Reballing Stencil for iPhone 6-14 Series
8.49 £
Mechanic UFO WiFi IC BGA Reballing Stencil for iPhone 6-14 Series
In stock
8.49 £
Brand:
Mechanic
- iPhone 6 to 14 Series Coverage: Dedicated multi-model matrix designed for reballing WiFi IC modules and WLAN controller chips across iPhone 6 to 14 Pro Max.
- Heat-Resistant Japanese Stainless Steel: Precision laser-cut stencil engineered to prevent warping, flexing, and bulging under hot air reflow.
- Anti-Bridging Square Apertures: CNC laser-etched square cutouts with rounded corners ensure uniform solder paste release and prevent short circuits.
Details
Mechanic UFO WiFi IC BGA Reballing Stencil for iPhone 6 to 14 Series
Streamline WiFi chip replacement and logic board signal repairs with the Mechanic UFO WiFi IC BGA Reballing Stencil. Specially engineered for professional micro-soldering technicians and mobile repair specialists, this precision stencil covers Wi-Fi and WLAN controller integrated circuits across multi-generation iPhone logic boards.
Key Features & Performance
- Broad iPhone Model Compatibility: Features precise cutout matrices covering WiFi IC chips for iPhone 6, 6S, 7, 8, X, XS, XR, 11, 12, 13, and 14 series (including Mini, Pro, and Pro Max models).
- High-Grade Japanese Steel: Constructed from premium heat-resistant stainless steel to maintain complete flatness and stability during high-temperature hot air reflow.
- Clean Solder Paste Release: Laser-etched square cutouts with rounded internal corners facilitate smooth, predictable solder paste application without bridging.
- Microscope Alignment Guides: Etched position grids provide high contrast and clear visibility under microscope magnification for rapid IC alignment.
Applications
- iPhone 6 through 14 Pro Max WiFi / WLAN IC Reballing
- Greyed-Out WiFi Fix & Logic Board Signal Rework
- Mainboard Micro-Soldering & Component Replacement
Data
Weight:
40 g/pcs
