Mechanic No. 226 10cc Liquid Solder Flux Kit
10cc No-Clean Liquid PCB Soldering Flux Syringe Kit
- High-Activity Bonding: High-penetration liquid formula delivers rapid wetting action and instant thermal transfer for precision rework.
- Non-Conductive Formula: Leaves minimal, non-corrosive residue preventing electrical short circuits on fine-pitch traces.
- Complete Syringe Kit: Includes a syringe plunger and dispensing needle for controlled micro-dosing on dense circuitry.
Please Note: Pictures are for illustration purposes only. Includes syringe plunger and dispensing tip.
Mechanic No. 226 10cc Liquid Soldering Flux Kit
Achieve clean, high-reliability solder joints with the Mechanic No. 226 10cc Liquid Soldering Flux Kit. Engineered specifically for micro-soldering technicians and smartphone repair specialists, this high-performance liquid flux provides excellent thermal transfer and rapid wetting during delicate board-level repairs.
The No. 226 liquid flux features a no-clean, non-conductive formula that flows effortlessly across fine-pitch BGA pads, IC chips, and SMD components. Its precise syringe packaging enables controlled application directly onto target areas, reducing flux waste and minimizing cleanup time.
Key Performance Features:
- Fast High-Penetration Flow: Low-viscosity liquid formulation quickly penetrates dense component arrays and underfill margins.
- Non-Conductive & No-Clean: Dries to a clear, non-corrosive finish that eliminates electrical leakage risks.
- High Thermal Stability: Prevents premature drying and oxidation under continuous hot-air rework temperatures.
- Precision Syringe Delivery: Allows accurate dispensing on tiny BGA array pads and micro jumper wires.
- Wide Application Range: Ideal for logic board repair on iPhones, Android devices, laptops, and consumer electronics.