Mechanic NS58 158°C Solder Paste 40g Syringe

Professional 158°C Medium-Temperature Solder Paste Syringe for Electronics

The Mechanic NS58 158°C 40g Soldering Paste Syringe is a premium, medium-temperature lead-free solder paste designed for electronics technicians, micro-soldering specialists, and mobile phone repair workshops. Featuring a convenient 40g syringe barrel format, this solder paste enables effortless, controlled dispensing onto high-density PCB pads and micro-components.

Key Specifications & Benefits

• Targeted 158°C Melting Point: Formulated specifically for double-layer iPhone logic board middle frame soldering, CPU/IC chip reballing, and delicate flex cable attachments where standard 183°C/217°C heat could warp the board.
• Precision Syringe Delivery: Allows fine, accurate application without waste or cross-contamination, perfect for high-density BGA repair under a microscope.
• Strong & Bright Solder Joints: Forms durable, low-void solder spheres with high shear strength, resisting mechanical vibration and thermal expansion cycles.
• Low Residue & Anti-Oxidation: Leaves minimal, non-corrosive flux residue after reflow, reducing post-soldering clean-up time and solvent use.
• Universal Workshop Compatibility: Excellent for smartphone motherboards, tablet PCBs, automotive electronics, and delicate micro-smt rework.

Technical Specifications

• Model SKU: MNS5840
• MPN: NS58
• Product Type: Medium-Temperature Solder Paste
• Melting Temperature: 158°C
• Weight / Container: 40g Syringe Barrel
• Alloy Composition: Lead-Free Medium Temp Alloy
• Application Method: Micro Syringe Dispensing & BGA Stencil Printing
• Primary Application: Mobile Phone Motherboard Layering, BGA IC Reballing & PCB Rework