Mechanic GK8 BGA CPU IC Underfill Glue Remover Blade Set

Professional Micro-Soldering CPU & BGA Glue Scraping Set

The Mechanic GK8 BGA CPU IC Underfill Glue Edge Removal Set is an essential micro-soldering hand tool designed for mobile phone repair technicians, board-level service engineers, and micro-electronics specialists. Precision-milled from high-hardness alloy steel, this specialized blade set enables effortless removal of tough black resin, frame glue, and CPU/NAND underfill adhesive on smartphone motherboards.

Key Specifications & Benefits

• Specialized BGA & CPU Profiles: Contains hand-finished blade contours tailored specifically for slicing underfill resin, clearing frame glue, and cleaning BGA solder pads.
• Trace-Safe Micro-Milling: Ultra-thin flexible blade edges slide under delicate surface-mount chips without scratching solder mask or severing internal logic board traces.
• Hot Air Station Compatible: Built to withstand continuous high-temperature hot-air exposure during underfill softening and chip desoldering.
• Ergonomic Handheld Precision: Textured non-slip handle provides maximum tactile control for intricate micro-repairs under a workstation microscope.
• Durable & Wear-Resistant: Premium alloy steel maintains sharp, resilient edges through repeated scraping cycles on hardened adhesive.

Technical Specifications

• Model: Mechanic GK8 (MGK8)
• Product Type: BGA CPU IC Underfill & Edge Glue Removal Blade Set
• Material: Hand-Finished High-Hardness Alloy Steel
• Thermal Resistance: High-Temperature Hot Air Rework Safe
• Application: BGA IC Scraping, CPU/NAND Underfill Removal, Frame Glue Cleaning