Mechanic FXV009 0.009mm Insulated Silver Micro Jumper Wire 200m
Out of stock
8.99 £
Brand:
Mechanic
MPN:
FXV009 (MFXV0090-009I)
Out of stock
- Ultra-Fine 0.009mm Diameter: Sub-micron silver wire engineered for microscopic PCB trace repairs and BGA pad flyline jumpers.
- Enameled Insulation Coating: Prevents short circuits when crossing over adjacent components, traces, or multiple jumper wires.
- 99.9% Pure Silver Conductive Core: Delivers superior electrical performance, low resistance, and exceptional tensile strength for logic board repairs.
Details
Professional 0.009mm Insulated Silver Micro-Jumper Wire
The Mechanic FXV009 0.009mm Insulated Silver Jumper Wire is an ultra-fine micro-soldering consumable engineered specifically for advanced PCB technicians, BGA reballing specialists, and smartphone repair engineers. Featuring a sub-micron 0.009mm high-purity silver core wrapped in a protective insulating enamel coating, this ultra-thin flyline enables seamless circuit restoration on high-density micro-electronics without risking accidental short circuits.
Key Specifications & Benefits
- Ultra-Fine Sub-0.01mm Trace Repair: Microscopic 0.009mm diameter fits between ultra-dense BGA solder balls, micro-IC pins, and damaged multi-layer PCB traces.
- Short-Circuit Protective Insulation: Tough insulating enamel coating permits jumper wires to overlap and cross active traces safely without shorting out.
- 99.9% Pure Silver Alloy Core: Offers maximum electrical conductivity, low impedance, and high frequency signal integrity for modern smartphone logic board repair.
- Exceptional Flexibility & Tensile Strength: Specially treated silver alloy resists snapping, curling, or breaking under tweezers during fine micro-soldering tasks.
- Universal Micro-Electronics Application: Crucial for repairing iPhone Face ID tracks, Android CPU/RAM reballing flylines, MacBook logic board traces, and smartwatch circuitry.
Technical Specifications
- Model SKU: MFXV0090-009I
- MPN: FXV009 / FXV-009
- Product Type: Insulated Micro-Jumper Wire (Flyline)
- Wire Diameter: 0.009 mm (9 Micron)
- Material: High-Purity Silver Alloy with Insulating Enamel
- Insulation Status: Insulated (Enameled Coating)
- Spool Length: Approx. 200 Metres
- Application: Ultra-Fine Logic Board Trace Repair, BGA Pad Bridging & Micro-Flyline Soldering
Data
Weight:
50 g/pcs
