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Mechanic CMOV 559 10cc Soldering Flux Kit
Mechanic CMOV 559 10cc Soldering Flux Kit
6.99 £
  1. Soldering Flux
  1. Consumables
  2. Soldering Flux

Mechanic CMOV 559 10cc Soldering Flux Kit

Mechanic CMOV 559 10cc Soldering Flux Kit
Mechanic CMOV 559 10cc Soldering Flux Kit
Mechanic CMOV 559 10cc Soldering Flux Kit
Mechanic CMOV 559 10cc Soldering Flux Kit
Mechanic CMOV 559 10cc Soldering Flux Kit
Mechanic CMOV 559 10cc Soldering Flux Kit
Mechanic CMOV 559 10cc Soldering Flux Kit
Mechanic CMOV 559 10cc Soldering Flux Kit
Mechanic CMOV 559 10cc Soldering Flux Kit
Mechanic CMOV 559 10cc Soldering Flux Kit
In stock
6.99 £
Brand:
Mechanic

10cc No-Clean PCB Soldering Flux Syringe Kit

  • High-Activity Bonding: Delivers superior wetting action and heat transfer for precise BGA reballing and SMD rework.
  • Non-Conductive Formula: Leaves minimal, non-corrosive residue preventing electrical short circuits on fine-pitch traces.
  • Complete Syringe Kit: Includes a syringe plunger and dispensing needle for controlled micro-dosing on dense circuitry.
Details

Please Note: Pictures are for illustration purposes only. Includes syringe plunger and dispensing tip.

Mechanic CMOV 559 10cc Soldering Flux Kit

Achieve clean, high-reliability solder joints with the Mechanic CMOV 559 10cc Soldering Flux Kit. Engineered specifically for micro-soldering technicians and smartphone repair specialists, this high-performance flux gel provides excellent thermal transfer and oxidation resistance during delicate board-level repairs.

The CMOV 559 flux gel features a no-clean, non-conductive formula that promotes smooth solder wetting across fine-pitch BGA pads, IC chips, and SMD components. Its precise syringe packaging enables controlled application directly onto target areas, reducing waste and minimizing cleanup time.

Key Performance Features:

  • Superior Wetting Performance: Accelerates solder flow and prevents bridging on high-density logic boards.
  • Non-Conductive & No-Clean: Dries to a clear, non-corrosive finish that eliminates electrical leakage risks.
  • High Thermal Stability: Prevents premature drying and oxidation under continuous hot-air rework temperatures.
  • Precision Syringe Delivery: Allows accurate dispensing on tiny BGA array pads and micro jumper wires.
  • Wide Application Range: Ideal for logic board repair on iPhones, Android devices, laptops, and consumer electronics.
Data
Weight:
60 g/pcs
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