Mechanic 034 PCB NAND Underfill Edge Glue Remover Tips Set
11.49 £
Mechanic 034 PCB NAND Underfill Edge Glue Remover Tips Set
In stock
11.49 £
Brand:
Mechanic
MPN:
034 (M034)
Colour:
Silver / Metallic
- Precision NAND Glue Scraping: Specialized blade tip contours engineered specifically for slicing tough black resin underfill around NAND flash and CPU chips.
- Trace-Safe Flexible Steel: Ultra-thin alloy steel blades glide underneath surface-mount ICs without scratching logic board copper traces.
- Hot Air Station Resistant: High-hardness alloy steel construction withstands direct exposure to hot-air rework temperatures without warping.
Details
Professional Micro-Soldering NAND Underfill Scraping Tips
The Mechanic 034 PCB NAND Underfill Edge Glue Remover Tips Set is an essential micro-soldering hand tool designed for mobile phone repair technicians, board-level service engineers, and micro-electronics specialists. Precision-milled from high-hardness alloy steel, this specialized blade set enables effortless removal of tough black resin, frame glue, and CPU/NAND underfill adhesive on smartphone motherboards.
Key Specifications & Benefits
- Specialized NAND & IC Profiles: Contains hand-finished blade contours tailored specifically for slicing underfill resin, clearing frame glue, and cleaning BGA solder pads.
- Trace-Safe Micro-Milling: Ultra-thin flexible blade edges slide under delicate surface-mount chips without scratching solder mask or severing internal logic board traces.
- Hot Air Station Compatible: Built to withstand continuous high-temperature hot-air exposure during underfill softening and chip desoldering.
- Universal Handle Mounting: Standardized blade shanks fit securely into standard precision scalpel handles and micro-soldering knife holders.
- Durable & Wear-Resistant: Premium alloy steel maintains sharp, resilient edges through repeated scraping cycles on hardened adhesive.
Technical Specifications
- Model: Mechanic 034 (M034)
- Product Type: PCB NAND Underfill & Edge Glue Removal Blade Set
- Material: Hand-Finished High-Hardness Alloy Steel
- Thermal Resistance: High-Temperature Hot Air Rework Safe
- Application: NAND Flash / CPU Underfill Removal, BGA Chip Edge Scraping, Frame Glue Cleaning
Data
Weight:
100 g/pcs
