MaAnt WiFi BB CPU NFC BGA Reballing Stencil for iPhone 7-14 Series
8.99 £
MaAnt WiFi BB CPU NFC BGA Reballing Stencil for iPhone 7-14 Series
In stock
8.99 £
Brand:
MaAnt
- iPhone 7 to 14 Series Coverage: Dedicated multi-chip matrix for reballing WiFi, Baseband, CPU, and NFC ICs across iPhone 7 to 14 Pro Max.
- Heat-Resistant Japanese Steel: Premium stainless steel construction prevents stencil warping, flexing, and bulging during hot air reflow.
- Anti-Bridging Laser Cutouts: Precision laser-etched square apertures ensure clean solder paste release and prevent short circuits.
Details
MaAnt WiFi, Baseband, CPU & NFC BGA Reballing Stencil for iPhone 7 to 14 Series
Simplify mainboard chip reballing and logic board repair with the MaAnt WiFi BB CPU NFC BGA Reballing Stencil. Engineered specifically for mobile phone repair technicians and micro-soldering specialists, this versatile stencil provides precise matrix cutouts for essential ICs across multi-generation iPhones.
Key Features & Performance
- Broad Model & IC Support: Features accurate cutout arrays covering WiFi modules, Baseband processors, A-series CPUs, and NFC controller chips from iPhone 7 up to iPhone 14 Pro Max.
- High-Grade Japanese Steel: Manufactured from heat-resistant stainless steel that resists deformation and remains completely flat under high hot air reflow temperatures.
- Clean Solder Paste Release: CNC laser-etched square cutouts with rounded internal corners facilitate smooth solder paste application without bridging.
- Microscope Alignment Markings: Crisp etched guides ensure exact IC alignment under microscope magnification.
Applications
- iPhone 7 / 8 / X / XS / XR / 11 / 12 / 13 / 14 Series Logic Board Repairs
- WiFi IC, Baseband Processor, CPU & NFC Chip Reballing
- Mainboard Micro-Soldering & Component Rework
Data
Weight:
40 g/pcs
