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MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
12.99 £

MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set

MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
MaAnt MY-102 4-in-1 BGA CPU IC Underfill Glue Remover Set
In stock
12.99 £
Brand:
MaAnt
MPN:
MY-102 (MAMY102)
Colour:
Silver / Metallic
  • 4 Specialized Precision Blades: Includes four hand-finished blade shapes engineered for slicing CPU underfill, cleaning frame glue, and clearing BGA pads.
  • Ultra-Thin Flexible Steel: High-hardness alloy blades glide smoothly beneath micro-chips without scratching logic board copper traces.
  • High Heat Resistance: Withstands continuous high-temperature exposure from hot air rework stations during chip removal.
Details

Professional 4-in-1 Micro-Soldering Glue Scraping Tool Kit

The MaAnt MY-102 4 in 1 BGA CPU IC Underfill Glue Edge Removal Set is an essential micro-soldering hand tool designed for mobile repair technicians, board-level service engineers, and micro-electronics specialists. Precision-milled from high-hardness alloy steel, this 4-piece blade set enables effortless removal of tough black resin, frame adhesive, and CPU/NAND underfill glue on smartphone logic boards.

Key Specifications & Benefits

  • Four Versatile Blade Profiles: Features sickle, hook, flat scraper, and corner blade shapes tailored for precise glue slicing, pad cleaning, and chip edge scraping.
  • Trace-Safe Micro-Milling: Flexible, ultra-thin blade edges slide beneath surface-mount ICs and BGA chips without scratching solder mask or severing internal copper traces.
  • Hot Air Station Compatible: Engineered to withstand direct high-temperature hot air exposure during underfill softening and IC desoldering.
  • Ergonomic Handheld Precision: Non-slip comfortable handles provide tactile control required for delicate micro-repairs under a microscope.
  • Durable & Wear-Resistant: Premium alloy steel construction holds sharp, flexible edges through repeated scraping sessions.

Technical Specifications

  • Model: MaAnt MY-102 (MAMY102)
  • Product Type: BGA CPU IC Underfill & Edge Glue Removal Blade Set
  • Set Count: 4-in-1 Precision Blades
  • Material: Hand-Finished High-Hardness Alloy Steel
  • Thermal Resistance: High-Temperature Hot Air Rework Safe
  • Application: BGA IC Scraping, CPU/NAND Underfill Removal, Frame Glue Cleaning
Data
Weight:
100 g/pcs
MicroSoldering Supplies
MicroSoldering Supplies
MicroSoldering Supplies
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