MaAnt CJY-01 250ml BGA IC Chip Epoxy Underfill Remover Liquid

Professional BGA IC Underfill Softening Solvent

The MaAnt CJY-01 Underfill Remover Aid (250ml) is a specialised chemical softening solution engineered for mobile repair technicians, micro-soldering specialists, and PCB reballing engineers. Formulated to target tough factory epoxy encapsulation, CJY-01 rapidly breaks down hardened underfill resin surrounding BGA chips, CPUs, power ICs, and NAND flash memory on smartphone and tablet logic boards.

Key Specifications & Benefits

• Efficient Chemical Breakdown: Penetrates micro-gaps beneath integrated circuits to soften black, white, and transparent underfill, enabling clean removal without aggressive scraping.
• Protects Delicate Circuitry: Non-corrosive formula safeguards underlying copper solder pads, trace wiring, and green/black PCB mask layers from chemical etching.
• Reduces Scraping Resistance: Dramatically lowers the heat and mechanical force required during chip prying, minimising the risk of torn solder pads or damaged CPU dies.
• High-Capacity Workshop Size: Supplied in a sturdy 250ml bottle designed for long-term bench use and easy transfer to precision needle-tip bottles.
• Universal Logic Board Application: Ideal for Apple iPhone, iPad, Samsung Galaxy, and Android smartphone logic board repairs.

Technical Specifications

• Model: MaAnt CJY-01
• Product Type: BGA IC Underfill Softening & Removal Fluid
• Volume: 250ml
• Target Material: Epoxy Resin / Polyurethane Underfill
• Chemical Properties: High-Permeability Non-Corrosive Solvent
• Application: BGA, IC, CPU & NAND Chip Refurbishment

Usage & Safety Guidelines

Apply a small amount directly onto the target chip perimeter using a fine dispenser or brush. Allow solvent to penetrate for several minutes, then apply mild hot air (approx. 150°C–200°C) to scrape away softened underfill using a non-scratch pry blade or dental pick. Use in a well-ventilated workshop environment.