LKG LKGS-1G Liquid Metal Thermal Compound 1g Set 128W/m.K

Professional High-Conductivity Liquid Metal Thermal Compound Kit

The LKG LKGS-1G Liquid Metal Thermal Compound Paste Set (1g) is an extreme-grade thermal interface material designed for experienced technicians, overlockers, and high-performance system builders. Formulated from a eutectic metal alloy blend of gallium, indium, and tin, this compound yields an extraordinary thermal conductivity rating of 128 W/m.K to drastically lower CPU and GPU temperatures under extreme thermal loads.

Key Specifications & Benefits

• 128 W/m.K Thermal Performance: Transfers heat away from processor dies exponentially faster than traditional silicone or carbon-based thermal pastes.
• Complete Application Accessories: Supplied with 0.4ml Type 704 white insulating silicone glue to protect surrounding SMD components, 2x 0.5g thermal paste tubes, cotton swabs, and protective finger cots.
• Precision Micro-Needle Dispensing: Includes a fine synthetic dispensing tip for controlled, pinpoint application on polished copper heat spreaders.
• Long-Term Stability: Non-curing eutectic alloy maintains liquid state across operational temperatures from +10°C to +140°C without drying out.

Important Safety & Compatibility Warning

DO NOT USE WITH ALUMINUM HEATSINKS: Liquid metal will react severely with aluminum, leading to rapid material corrosion and heatsink destruction. Use strictly with nickel-plated copper or solid copper contact plates. Because liquid metal is 100% electrically conductive, insulation of surrounding surface-mount components (using the included 704 silicone sealer) is required prior to application.

Technical Specifications

• Model: LKGS-1G (LKGSLM1G)
• Thermal Conductivity: 128 W/m.K
• Net Weight: 1g Syringe
• Viscosity: 0.0021 Pa·s
• Density: 6.24 g/cm³
• Operating Temperature Range: +10°C to +140°C
• Electrical Conductivity: Highly Conductive
• Heatsink Compatibility: Nickel-Plated Copper & Pure Copper Only (NO ALUMINUM)