JCID UF6008 Black Chip Underfill Adhesive Syringe 5ml

Professional BGA Chip Underfill & Edge Sealing Epoxy

The JCID UF6008 Black Chip Underfill Adhesive is a high-performance epoxy compound engineered specifically for smartphone logic board technicians, BGA reballing specialists, and screen refurbishing engineers. Designed to mirror original factory encapsulation standards, this 5ml black adhesive provides vital mechanical reinforcement and thermal protection around delicate CPU, RAM, and NAND flash chips.

Key Specifications & Benefits

• Enhanced Mechanical Stability: Absorbs physical shock, vibration, and thermal expansion stress, protecting microscopic BGA solder balls from cracking or lifting off pads.
• High Thermal Conductivity: Efficiently dissipates heat away from high-power CPUs and memory ICs directly to the motherboard substrate to prevent thermal throttling.
• Ergonomic 5ml Syringe Dispenser: Enables accurate, mess-free application into narrow chip seams and board edges without waste or overflow.
• Versatile Board & Screen Encapsulation: Ideal for CPU underfilling, NAND packaging, micro-component sealing, and screen frame edge repair across Apple, Samsung, and Android devices.

Technical Specifications

• Model SKU: JCIDUF6008
• MPN: UF6008
• Product Type: BGA Chip Underfill & Board Sealing Adhesive
• Volume Capacity: 5ml
• Adhesive Material: High-Grade Black Epoxy Resin
• Application Method: Manual Syringe Dispenser
• Curing Profile: Thermal / UV Assisted Curing
• Application Scope: BGA IC Underfilling, CPU / NAND Packaging & Board Edge Sealing