Bozan BA-13 iPhone Pre-Heating Station X-15 Series
Universal iPhone Logic Board Pre-Heating Station
- X-15 Series Compatibility: Universal heating platform designed for iPhone X through 15 Pro Max double-decker logic board separation.
- Rapid & Uniform Heating: Delivers precise thermal distribution to melt solder joints without warping or overheating surrounding ICs.
- Digital Temperature Control: Features intuitive controls for exact heat settings, ensuring safe and repeatable micro-soldering rework.
Please Note: Pictures are for illustration purposes only.
Bozan BA-13 iPhone Logic Board Pre-Heating Station
Upgrade your micro-soldering capabilities with the Bozan BA-13 Universal Pre-Heater, engineered specifically for iPhone double-decker motherboard separation and reballing. Supporting iPhone models from X all the way through to 15 Pro Max, this all-in-one heating platform delivers fast, uniform heat distribution to safely split layered PCBs without thermal stress.
Equipped with intelligent digital temperature management, the BA-13 prevents motherboard warping and protects delicate surface-mounted ICs. Its compact workshop footprint and modular heating surface make it an essential tool for professional phone repair technicians and board-level repair shops.
Key Features:
- Wide iPhone Compatibility: Modular pre-heating platform supports iPhone X, XS, 11, 12, 13, 14, and 15 series motherboards.
- Precise Thermal Management: Even heat dispersal ensures clean separation of upper and lower logic board layers.
- Digital Temperature Control: Easily adjust and monitor heating profiles for consistent, safe desoldering.
- IC & Board Protection: Prevents thermal degradation and circuit board warping caused by uneven hot air heating.
- Durable Workbench Build: Heat-resistant, heavy-duty alloy chassis designed for daily professional repair shop use.