Amaoe iP 13 Series BGA Reballing Stencil
7.49 £
Amaoe iP 13 Series BGA Reballing Stencil
In stock
7.49 £
Brand:
Amaoe
- Tailored for iPhone 13 Series: Custom laser-etched BGA reballing stencil covering iPhone 13, 13 Mini, 13 Pro, and 13 Pro Max logic boards.
- Heat-Resistant Japanese Steel: High-grade stainless steel construction prevents bulging, warping, and deformation during hot air reflow.
- Anti-Bridging Square Cutouts: Precision square rounded-corner apertures ensure smooth solder paste release and prevent short circuits.
Details
Amaoe iPhone 13 Series BGA Reballing Stencil
Perform precise logic board repairs with the Amaoe iP 13 Series BGA Reballing Stencil. Specially engineered for professional micro-soldering technicians, this high-precision stencil covers all essential IC reballing patterns and middle-layer board alignments for the iPhone 13, 13 Mini, 13 Pro, and 13 Pro Max.
Key Features & Performance
- Dedicated iPhone 13 Matrix: Features accurate cutout positions for A15 Bionic CPU, Baseband, PMIC, Audio IC, NAND flash, and interposer middle board reballing.
- High-Grade Japanese Steel: Manufactured from premium heat-resistant stainless steel that maintains flat positioning under high benchtop temperatures.
- Precision Laser-Cut Openings: CNC laser-etched square cutouts with rounded internal corners ensure uniform solder paste release and prevent solder ball bridging.
- Microscope Alignment Markings: Etched guides provide clear visibility under microscope magnification for instant IC placement.
Applications
- iPhone 13 / 13 Mini / 13 Pro / 13 Pro Max Board-Level Micro-Soldering
- Double-Decker Logic Board Reballing & Re-Joining
- Power Management IC, Baseband & A15 CPU Rework
Data
Weight:
40 g/pcs
